Skill-less rework device MS9000SE II Series
BGA rework has become this easy! This rework device can handle BGA, CSP, and microchips all with one machine.
Achieving "skill-less" rework tasks with a wide variety of options. 1. Two models available (Semi-auto / Auto) 2. Features of "skill-less" - Three points (1) Automatic acquisition of temperature profiles It is possible to acquire temperature profiles while removing components. Rework tasks can be performed even without sample boards. (2) Alignment function (Pattern matching / Visual move) A unique feature that allows easy alignment of boards and components with just a click. Patent obtained. (3) Solder cleaning The device's heater provides heating power that cannot be achieved with hand tools, absorbing and removing melted solder. This enables stable cleaning tasks in a short time. 3. Flexible "function expansion" Support for switching to IR method, chip unit capable of handling small chip components, solder cleaning unit, and a high-resolution external camera capable of capturing still images and videos. 4. Balancing precision within 20μm and ease of use 5. Complete in-house development and manufacturing Development and manufacturing are consistently carried out in our domestic factory, allowing us to meet various customer demands.
- Company：メイショウ
- Price：Other
